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Ieee Transactions on Advanced Packaging

Journal Abbreviation: IEEE T ADV PACKAGING
Journal ISSN: 1521-3323

About Ieee Transactions on Advanced Packaging

    IEEE Transactions on Advanced Packaging was the number two most-cited journal in manufacturing engineering in 2003, according to the annual Journal Citation Report (2003 edition) published by the Institute for Scientific Information. This publication has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.
Year Impact Factor (IF) Total Articles Total Cites
2022 (2023 update) - -
2021 - -
2020 - -
2019 - -
2018 - -
2017 - -
2016 - -
2015 - -
2014 - -
2013 - -
2012 - -
2011 - -
2010 1.276 115 1206

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