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Microelectronics International

Journal Abbreviation: MICROELECTRON INT
Journal ISSN: 1356-5362

About Microelectronics International

    Microelectronics International comprises a multi-disciplinary study of the key technologies and related issues associated with the design, manufacture, assembly and various applications of miniaturised electronic devices and advanced packages. Among the broad range of topics covered are:<br/><br/>advanced packaging <br/>ball grid array (BGA) <br/>ceramics <br/>chip attachment <br/>chip on board (COB) <br/>chip scale packaging (CSP) <br/>dieing <br/>land grid array (LGA) <br/>micro-circuit technology<br/>multichip modules (MCMs)<br/>scribing <br/>semiconductor technology <br/>thick/thin film technology
Year Impact Factor (IF) Total Articles Total Cites
2024 (2025 update) 0.8 - 301
2023 0.7 - -
2022 1.1 - 282
2021 0.942 - 261
2020 0.758 22 225
2019 0.796 31 266
2018 0.840 31 188
2017 0.608 23 189
2016 0.737 27 194
2015 0.519 24 148
2014 0.659 33 129
2013 0.872 21 154
2012 0.731 20 134
2011 0.600 27 125

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